Description
Manufacturing-grade material offered with consistent quality and traceability. Designed for radiation-curable systems to deliver fast cure, good film properties, and formulation flexibility.
Uses
UV/EB-curable coatings, inks, overprint varnishes, and pressure-sensitive adhesives.
Benefits
High reactivity for fast cure; good compatibility with common resins; supports durable crosslinking.
Safety, Compliance & Notes
| Thermal Conductivity | – |
| Electrical Conductivity | ≈ 1 × 10⁻¹¹ to 1 × 10⁻-S/cm |
| Heat of Formation | -kJ/mol |
| Heat of Vaporization | – |
| Structure | CH2=C(CH3)–C(=O)–O– |
| CAS Number | – |
| EINECS Number | – |
| Storage & Packaging | Keep in original, tightly sealed containers in a dry, ventilated place away from heat and moisture. Prevent exposure to UV/light and contaminants to avoid premature polymerization. Packaging: as per customer requirement. |
| Product Stewardship | Use under trained supervision. Follow SDS and local regulatory requirements. Dispose of waste as per applicable rules. |
| Note | Final application suitability should be verified by customer trials and formulation evaluation. |
| Notice | Handle and store as per SDS. Typical data is for guidance and not a specification unless stated in COA. |
