Description
Industrial grade supplied with controlled specification and documentation. Suitable for UV/EB formulations requiring balanced viscosity, reactivity, and durable performance.
Uses
Radiation-curable printing inks, wood/metal/plastic coatings, and electronic encapsulation.
Benefits
Improves hardness, chemical resistance, and adhesion in cured films; consistent processing behavior.
Safety, Compliance & Notes
| Thermal Conductivity | 0.1–0.3 W/m·K |
| Electrical Conductivity | 0.00000001 – 0.000001 S/cm |
| Heat of Formation | -kJ/mol |
| Heat of Vaporization | 55–65 kJ/mol |
| Structure | CH2=C(CH3)–C(=O)–O–CH2–CH2–CH2–Si(OCH3)3 |
| CAS Number | 2530-85-0 |
| EINECS Number | 253-039-2 |
| Storage & Packaging | Store in a cool, dry, well-ventilated area. Keep container tightly closed and protected from direct sunlight. Protect from heat and light; maintain inhibitor system if applicable. Avoid prolonged storage at elevated temperatures. Packaging: HDPE drums. |
| Product Stewardship | Ensure safe handling, spill control, and waste disposal per SDS and statutory norms. Maintain traceability for batches. |
| Note | Specifications and typical values may vary by grade/batch; confirm requirements before procurement. |
| Notice | For industrial use only. Not for direct consumer use. Refer SDS/COA for detailed specifications. |
