Description
A formulated synthetic-polymer adhesive for strong, durable bonding of wood and other compatible substrates; available in water-based, solvent-based, hot-melt and reactive grades.
Uses
Used for furniture, carpentry, joinery, plywood and blockboard manufacture, laminating, veneering, edge banding, panel assembly, packaging, flooring, construction and repairs. Suitable grades bond wood, plywood, MDF, particle board, laminates, veneers, cork, paper and other compatible porous materials.
Benefits
Strong bonding, quick setting, easy application, good coverage, lasting durability, moisture resistance and a clean finish.
Safety, Compliance & Notes
| Thermal Conductivity | Not routinely specified; formulation-dependent. |
| Electrical Conductivity | Not routinely specified; formulation-dependent. |
| Heat of Formation | Not applicable to a formulated product class. |
| Heat of Vaporization | Not applicable to a formulated product class. |
| Structure | Polymeric resin mixture; structure varies by resin chemistry and formulation. |
| CAS Number | No single CAS number; formulated mixture. Component CAS numbers are listed in the product SDS. |
| EINECS Number | No single EC/EINECS number; formulated mixture. |
| Storage & Packaging | Store sealed in the original container in a cool, dry, well-ventilated place away from heat and direct sunlight. Protect water-based grades from freezing. Keep incompatible materials separate and use within stated shelf life. |
| Product Stewardship | Minimize waste, prevent discharge to drains or soil, and dispose of uncured adhesive and contaminated packaging according to the SDS and local regulations. Cured material may require different disposal handling. |
| Note | Category-level data; exact composition and properties vary substantially by resin family and commercial grade. |
| Notice | Category-level information only. Properties vary by resin type and grade. Confirm all specifications using the manufacturer’s current TDS and SDS. |
