Description
High-quality product supplied for industrial customers with standard documentation. Used to adjust viscosity, improve wetting/flow, and support stable processing in formulations.
Uses
Formulation solvent for coatings/adhesives/chemicals where solvency and evaporation profile matter.
Benefits
Assists dissolution and cleaning; predictable evaporation behavior (grade dependent).
Safety, Compliance & Notes
| Thermal Conductivity | 0.12W/m·K. |
| Electrical Conductivity | 0.02S/cm |
| Heat of Formation | 550 to -570 kJ/mol |
| Heat of Vaporization | 46.8kJ/mol |
| Structure | Hydrocarbon or oxygenated solvent structure suited to industrial blending. |
| CAS Number | 14694-95-2 |
| EINECS Number | 238-733-8 |
| Storage & Packaging | Store under recommended conditions; protect from contamination and keep away from direct sunlight/heat sources. Maintain proper bonding/grounding during transfer. Use approved containers for flammable liquids. Packaging: as per customer requirement. |
| Product Stewardship | Ensure safe handling, spill control, and waste disposal per SDS and statutory norms. Maintain traceability for batches. |
| Note | Specifications and typical values may vary by grade/batch; confirm requirements before procurement. |
| Notice | For industrial use only. Not for direct consumer use. Refer SDS/COA for detailed specifications. |
