Description
High-quality product supplied for industrial customers with standard documentation. Designed for radiation-curable systems to deliver fast cure, good film properties, and formulation flexibility.
Uses
Reactive diluent/oligomer component for UV coatings, adhesives, and composite resins.
Benefits
High reactivity for fast cure; good compatibility with common resins; supports durable crosslinking.
Safety, Compliance & Notes
| Thermal Conductivity | – |
| Electrical Conductivity | -0.0000001 – 0.000005 S/cm |
| Heat of Formation | –418 kJ/mol |
| Heat of Vaporization | 50.3 kJ/mol |
| Structure | (CH₂=CH–C(=O)–) |
| CAS Number | 818‑61‑1 |
| EINECS Number | 212‑454‑9 |
| Storage & Packaging | Store under recommended conditions; protect from contamination and keep away from direct sunlight/heat sources. Protect from heat and light; maintain inhibitor system if applicable. Avoid prolonged storage at elevated temperatures. Packaging: HDPE drums. |
| Product Stewardship | Use under trained supervision. Follow SDS and local regulatory requirements. Dispose of waste as per applicable rules. |
| Note | Final application suitability should be verified by customer trials and formulation evaluation. |
| Notice | Handle and store as per SDS. Typical data is for guidance and not a specification unless stated in COA. |
